• DocumentCode
    1305286
  • Title

    Characterizing the Capacitive Crosstalk in SRAM Cells Using Negative Bit-Line Voltage Stress

  • Author

    Bae, Jongsun ; Baeg, Sanghyeon ; Park, Sungju

  • Author_Institution
    Sch. of Electr. Eng. & Comput. Sci., Hanyang Univ., Ansan, South Korea
  • Volume
    61
  • Issue
    12
  • fYear
    2012
  • Firstpage
    3259
  • Lastpage
    3272
  • Abstract
    The physical distance between adjacent memory cells is rapidly decreasing as memory density increases and technology geometry shrinks. As a result of the narrower distance, the capacitance between adjacent cells, which are referred to as the cell coupling capacitor (CCCP), increases and behaves as the source of crosstalk. The crosstalk is further aggravated by increasing operational speeds. When the sizes of the CCCP are marginal, they may not be detected by normal test patterns but can appear when various stresses accumulate. When they are not detected in an early manufacturing stage, they become the source of intermittent failures. Creating a complex test environment is sometimes rejected at the expense of higher parts per million of a device. In this paper, a negative voltage stress is applied to bit lines to test and diagnose the issues from the marginal CCCP. The negative voltage level is closely correlated to the CCCP size, which implies that the proposed method can be used as a vehicle to diagnose the potential issues due to cell coupling capacitors. The simulation results demonstrated that the negative stress voltage can screen the cell coupling capacitors from a few femtofarads to tens of femtofarads in an experimental circuit. The proposed technique has been validated by test chip using 130-nm technology.
  • Keywords
    SRAM chips; capacitors; crosstalk; failure analysis; integrated circuit reliability; integrated circuit testing; SRAM cells; adjacent memory cells; capacitive crosstalk characterization; cell coupling capacitor; intermittent failures; memory density; negative bit-line voltage stress; negative voltage level; negative voltage stress; size 130 nm; technology geometry shrinks; test chip; test patterns; Capacitance; Crosstalk; Random access memory; Stress; Bit line; capacitive defect; cell coupling capacitor ( $C_{rm CCP}$); crosstalk; memory; negative voltage stress (NVS);
  • fLanguage
    English
  • Journal_Title
    Instrumentation and Measurement, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9456
  • Type

    jour

  • DOI
    10.1109/TIM.2012.2211472
  • Filename
    6320627