DocumentCode
1305286
Title
Characterizing the Capacitive Crosstalk in SRAM Cells Using Negative Bit-Line Voltage Stress
Author
Bae, Jongsun ; Baeg, Sanghyeon ; Park, Sungju
Author_Institution
Sch. of Electr. Eng. & Comput. Sci., Hanyang Univ., Ansan, South Korea
Volume
61
Issue
12
fYear
2012
Firstpage
3259
Lastpage
3272
Abstract
The physical distance between adjacent memory cells is rapidly decreasing as memory density increases and technology geometry shrinks. As a result of the narrower distance, the capacitance between adjacent cells, which are referred to as the cell coupling capacitor (CCCP), increases and behaves as the source of crosstalk. The crosstalk is further aggravated by increasing operational speeds. When the sizes of the CCCP are marginal, they may not be detected by normal test patterns but can appear when various stresses accumulate. When they are not detected in an early manufacturing stage, they become the source of intermittent failures. Creating a complex test environment is sometimes rejected at the expense of higher parts per million of a device. In this paper, a negative voltage stress is applied to bit lines to test and diagnose the issues from the marginal CCCP. The negative voltage level is closely correlated to the CCCP size, which implies that the proposed method can be used as a vehicle to diagnose the potential issues due to cell coupling capacitors. The simulation results demonstrated that the negative stress voltage can screen the cell coupling capacitors from a few femtofarads to tens of femtofarads in an experimental circuit. The proposed technique has been validated by test chip using 130-nm technology.
Keywords
SRAM chips; capacitors; crosstalk; failure analysis; integrated circuit reliability; integrated circuit testing; SRAM cells; adjacent memory cells; capacitive crosstalk characterization; cell coupling capacitor; intermittent failures; memory density; negative bit-line voltage stress; negative voltage level; negative voltage stress; size 130 nm; technology geometry shrinks; test chip; test patterns; Capacitance; Crosstalk; Random access memory; Stress; Bit line; capacitive defect; cell coupling capacitor ( $C_{rm CCP}$ ); crosstalk; memory; negative voltage stress (NVS);
fLanguage
English
Journal_Title
Instrumentation and Measurement, IEEE Transactions on
Publisher
ieee
ISSN
0018-9456
Type
jour
DOI
10.1109/TIM.2012.2211472
Filename
6320627
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