• DocumentCode
    1305438
  • Title

    Hybrid MOSFET/driver for ultra-fast switching

  • Author

    Tang, T. ; Burkhart, C.

  • Author_Institution
    Stanford Linear Accel. Center, Menlo Park, CA, USA
  • Volume
    16
  • Issue
    4
  • fYear
    2009
  • fDate
    8/1/2009 12:00:00 AM
  • Firstpage
    967
  • Lastpage
    970
  • Abstract
    The ultra-fast switching of power MOSFETs, in about 1 ns, is very challenging. This is largely due to the parasitic inductance that is intrinsic to commercial packages used for both MOSFETs and drivers. Parasitic gate and source inductance not only limit the voltage rise time on the MOSFET internal gate structure but can also cause the gate voltage to oscillate. This paper describes a hybrid approach that substantially reduces the parasitic inductance between the driver and MOSFET gate, as well as between the MOSFET source and its external connection. A flip-chip assembly is used to directly attach a die-form power MOSFET and driver on a PCB. The parasitic inductances are significantly reduced by eliminating bond wires and minimizing lead length. The experimental results demonstrate ultra-fast switching of the power MOSFET with excellent control of the gate-source voltage.
  • Keywords
    flip-chip devices; power MOSFET; printed circuits; MOSFET internal gate structure; MOSFET source; die-form power MOSFET; flip-chip assembly; gate-source voltage; hybrid MOSFET-driver; parasitic gate; parasitic inductance; ultrafast switching; Assembly; Bonding; Driver circuits; Inductance; MOSFET circuits; Packaging; Power MOSFET; Switching circuits; Voltage; Wires; MOSFET switches, power MOSFETs, high-speed electronics, pulse power system switches, Hybrid integrated circuits, flip-chip devices.;
  • fLanguage
    English
  • Journal_Title
    Dielectrics and Electrical Insulation, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1070-9878
  • Type

    jour

  • DOI
    10.1109/TDEI.2009.5211841
  • Filename
    5211841