Title :
Electromagnetic simulation of bonding wires and comparison with wide band measurements
Author :
Schuster, Christian ; Leonhardt, Götz ; Fichtner, Wolfgang
Author_Institution :
Dept. of Electr. Eng., Swiss Fed. Sch. of Technol., Zurich, Switzerland
fDate :
2/1/2000 12:00:00 AM
Abstract :
Several typical bonding wire configurations have been measured in a frequency range up to 20 GHz using a vector network analyzer. Based on scanning electron microscope (SEM) pictures all bonding wires have been discretized and orthogonal grids suitable for electromagnetic simulation have been generated. Full wave finite difference time domain (FDTD) simulations as well as static and quasi static inductance extraction using a new Monte Carlo technique and FastHenry as well as capacitance extraction with a finite element method have been carried out. Numerical results are compared to measured scattering parameters and their quality and frequency dependence is discussed. All simulation techniques are evaluated with respect to their computational effort
Keywords :
Monte Carlo methods; S-parameters; finite difference time-domain analysis; integrated circuit packaging; lead bonding; network analysers; scanning electron microscopy; 0 to 20 GHz; FastHenry; Monte Carlo technique; bonding wires; capacitance extraction; computational effort; electromagnetic simulation; finite element method; full wave finite difference time domain simulations; orthogonal grids; quasi static inductance extraction; scanning electron microscope; scattering parameters; static inductance extraction; vector network analyzer; wide band measurements; Bonding; Electromagnetic measurements; Finite difference methods; Frequency measurement; Inductance; Mesh generation; Numerical analysis; Scanning electron microscopy; Time domain analysis; Wires;
Journal_Title :
Advanced Packaging, IEEE Transactions on
DOI :
10.1109/6040.826764
