The use of metal filled via holes for improving isolation in LTCC RF and wireless multichip packages

Author

Ponchak, George E. ; Chun, Donghoon ; Yook, Jong-Gwan ; Katehi, Linda P B

Author_Institution

Electron. Device Technol. Branch, NASA Glenn Res. Center, Cleveland, OH, USA

Volume

23

Issue

1

fYear

2000

fDate

2/1/2000 12:00:00 AM

Firstpage

88

Lastpage

99

Abstract

LTCC MCM´s for RF and wireless systems often use metal filled via holes to improve isolation between the stripline and microstrip interconnects. In this paper, results from a 3D-FEM electromagnetic characterization of microstrip and stripline interconnects with metal filled via fences for isolation are presented. It is shown that placement of a via hole fence closer than three times the substrate height to the transmission lines increases radiation and coupling. Radiation loss and reflections are increased when a short via fence is used in areas suspected of having high radiation. Also, via posts should not be separated by more than three times the substrate height for low radiation loss, coupling, and suppression of higher order modes in a package

Keywords

ceramic packaging; finite element analysis; multichip modules; 3D FEM electromagnetic model; LTCC MCM package; RF system; isolation; metal filled via hole fences; microstrip interconnect; microwave transmission line; stripline interconnect; wireless system; Ceramics; Coupling circuits; Crosstalk; Distributed parameter circuits; Electronics packaging; Integrated circuit interconnections; Microstrip; NASA; Radio frequency; Stripline;

fLanguage

English

Journal_Title

Advanced Packaging, IEEE Transactions on

Publisher

ieee

ISSN

1521-3323

Type

jour

DOI

10.1109/6040.826766

Filename

826766