DocumentCode
1309518
Title
Multistage Planar Thermoelectric Microcoolers
Author
Gross, A.J. ; Gi Suk Hwang ; Baoling Huang ; Hengxi Yang ; Ghafouri, Niloufar ; Hanseup Kim ; Peterson, Rebecca L. ; Uher, C. ; Kaviany, M. ; Najafi, Khalil
Author_Institution
Electr. Eng. & Comput. Sci. Dept., Univ. of Michigan, Ann Arbor, MI, USA
Volume
20
Issue
5
fYear
2011
Firstpage
1201
Lastpage
1210
Abstract
Many types of microsystems and microelectromechanical systems (MEMS) devices exhibit improved performance characteristics when operated below room temperature. However, designers rarely pair such devices with integrated cooling solutions because they add complexity to the system and often have power consumption which far exceeds that of the microsystem itself. We report the design, fabrication, and testing of both one- and six-stage thermoelectric (TE) microcoolers that target MEMS applications through optimization for low-power operation. Both coolers use thin-film Bi2Te3 and Sb2Te3 as the n-and p-type TE materials, respectively, and operate in a planar configuration. The six-stage cooler has demonstrated a ΔT = 22.3 °C at a power consumption of 24.8 mW, while the one-stage cooler has demonstrated a ΔT = 17.9 °C at a lower power consumption of 12.4 mW.
Keywords
antimony compounds; bismuth compounds; cooling; micromechanical devices; thermoelectric devices; thin film devices; Bi2Te3; Sb2Te3; integrated cooling solutions; microelectromechanical systems; multistage planar thermoelectric microcoolers; power 12.4 mW; power 24.8 mW; six-stage cooler; Conductivity; Cooling; Heating; Silicon; Substrates; Thermal conductivity; Microcooler; microelectromechanical systems (MEMS); solid-state cooling; thermoelectric (TE) devices;
fLanguage
English
Journal_Title
Microelectromechanical Systems, Journal of
Publisher
ieee
ISSN
1057-7157
Type
jour
DOI
10.1109/JMEMS.2011.2163302
Filename
6004801
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