• DocumentCode
    1309518
  • Title

    Multistage Planar Thermoelectric Microcoolers

  • Author

    Gross, A.J. ; Gi Suk Hwang ; Baoling Huang ; Hengxi Yang ; Ghafouri, Niloufar ; Hanseup Kim ; Peterson, Rebecca L. ; Uher, C. ; Kaviany, M. ; Najafi, Khalil

  • Author_Institution
    Electr. Eng. & Comput. Sci. Dept., Univ. of Michigan, Ann Arbor, MI, USA
  • Volume
    20
  • Issue
    5
  • fYear
    2011
  • Firstpage
    1201
  • Lastpage
    1210
  • Abstract
    Many types of microsystems and microelectromechanical systems (MEMS) devices exhibit improved performance characteristics when operated below room temperature. However, designers rarely pair such devices with integrated cooling solutions because they add complexity to the system and often have power consumption which far exceeds that of the microsystem itself. We report the design, fabrication, and testing of both one- and six-stage thermoelectric (TE) microcoolers that target MEMS applications through optimization for low-power operation. Both coolers use thin-film Bi2Te3 and Sb2Te3 as the n-and p-type TE materials, respectively, and operate in a planar configuration. The six-stage cooler has demonstrated a ΔT = 22.3 °C at a power consumption of 24.8 mW, while the one-stage cooler has demonstrated a ΔT = 17.9 °C at a lower power consumption of 12.4 mW.
  • Keywords
    antimony compounds; bismuth compounds; cooling; micromechanical devices; thermoelectric devices; thin film devices; Bi2Te3; Sb2Te3; integrated cooling solutions; microelectromechanical systems; multistage planar thermoelectric microcoolers; power 12.4 mW; power 24.8 mW; six-stage cooler; Conductivity; Cooling; Heating; Silicon; Substrates; Thermal conductivity; Microcooler; microelectromechanical systems (MEMS); solid-state cooling; thermoelectric (TE) devices;
  • fLanguage
    English
  • Journal_Title
    Microelectromechanical Systems, Journal of
  • Publisher
    ieee
  • ISSN
    1057-7157
  • Type

    jour

  • DOI
    10.1109/JMEMS.2011.2163302
  • Filename
    6004801