• DocumentCode
    13096
  • Title

    Ultradense Silicon Photonic Interface for Optical Interconnection

  • Author

    Peicheng Liao ; Sakib, Meer ; Fei Lou ; Jongchul Park ; Wlodawski, Mitchell ; Kopp, Victor I. ; Neugroschl, Dan ; Liboiron-Ladouceur, Odile

  • Author_Institution
    Dept. of Electr. & Comput. Eng., McGill Univ., Montreal, QC, Canada
  • Volume
    27
  • Issue
    7
  • fYear
    2015
  • fDate
    April1, 1 2015
  • Firstpage
    725
  • Lastpage
    728
  • Abstract
    A scalable ultradense silicon photonic interface with 61 compact vertical grating couplers on a pitch of 42.3 μm is designed and fabricated to match a pitch reducing optical fiber array (PROFA) hexagonal channel pattern. Experimental results show that the designed grating couplers with a minimum insertion loss of 4.5 dB and a 3-dB bandwidth of 50 nm are obtained. The crosstalk between different channels is less than -50 dB and the maximum loss difference across the PROFA interface is ~0.7 dB. High-speed data transmission indicates that a bandwidth density as large as 27 Tb/s/mm2 could be achieved within a footprint of 0.096 mm2, demonstrating the potential of silicon photonics for broadband optical interconnection.
  • Keywords
    diffraction gratings; elemental semiconductors; integrated optoelectronics; optical arrays; optical crosstalk; optical design techniques; optical fibre couplers; optical fibre fabrication; optical fibre losses; optical interconnections; silicon; Si; bandwidth density; broadband optical interconnection; compact vertical grating couplers; crosstalk; high-speed data transmission; insertion loss; pitch reducing optical fiber array hexagonal channel pattern; scalable ultradense silicon photonic interface; Arrays; Bandwidth; Couplers; Optical device fabrication; Optical fibers; Silicon photonics; Multicore fiber array; bandwidth density; optical interconnection; photonic integrated circuits (PICs); silicon photonics; vertical grating couplers;
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2015.2390540
  • Filename
    7006671