• DocumentCode
    1309736
  • Title

    The art of building LSIs

  • Author

    Hochman, Herschel T.

  • Author_Institution
    Honeywell Inc.
  • Volume
    6
  • Issue
    9
  • fYear
    1969
  • Firstpage
    29
  • Lastpage
    36
  • Abstract
    Today solid-state technology has improved to such a degree that very large IC chips are being made with yields up to 30 percent. This article highlights some of the main elements that determine whether LSIs can be manufactured in large quantities. The author claims that obtaining reasonable yields is readily achievable once the factors that stand out as deterrents to success are recognized. Previously developed manufacturing techniques are used for LSI production. In the future, however, lasers and the computer will be applied to enable engineers to produce components faster with greater reliability.
  • Keywords
    Art; Bonding; Circuit testing; Conductivity; Large scale integration; Manufacturing; Resistors; Silicon; Solid state circuit design; Solid state circuits;
  • fLanguage
    English
  • Journal_Title
    Spectrum, IEEE
  • Publisher
    ieee
  • ISSN
    0018-9235
  • Type

    jour

  • DOI
    10.1109/MSPEC.1969.5213671
  • Filename
    5213671