DocumentCode
1309736
Title
The art of building LSIs
Author
Hochman, Herschel T.
Author_Institution
Honeywell Inc.
Volume
6
Issue
9
fYear
1969
Firstpage
29
Lastpage
36
Abstract
Today solid-state technology has improved to such a degree that very large IC chips are being made with yields up to 30 percent. This article highlights some of the main elements that determine whether LSIs can be manufactured in large quantities. The author claims that obtaining reasonable yields is readily achievable once the factors that stand out as deterrents to success are recognized. Previously developed manufacturing techniques are used for LSI production. In the future, however, lasers and the computer will be applied to enable engineers to produce components faster with greater reliability.
Keywords
Art; Bonding; Circuit testing; Conductivity; Large scale integration; Manufacturing; Resistors; Silicon; Solid state circuit design; Solid state circuits;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/MSPEC.1969.5213671
Filename
5213671
Link To Document