Title :
An Overview of Solid-State Integrated Circuit Amplifiers in the Submillimeter-Wave and THz Regime
Author :
Samoska, Lorene A.
Author_Institution :
Jet Propulsion Lab., California Inst. of Technol., Pasadena, CA, USA
Abstract :
We present an overview of solid-state integrated circuit amplifiers approaching terahertz frequencies based on the latest device technologies which have emerged in the past several years. Highlights include the best reported data from heterojunction bipolar transistor (HBT) circuits, high electron mobility transistor (HEMT) circuits, and metamorphic HEMT (mHEMT) amplifier circuits. We discuss packaging techniques for the various technologies in waveguide modules and describe the best reported noise figures measured in these technologies. A consequence of THz transistors, namely ultra-low-noise at cryogenic temperatures, will be explored and results presented. We also present a short review of power amplifier technologies for the THz regime. Finally, we discuss emerging materials for THz amplifiers into the next decade.
Keywords :
HEMT integrated circuits; cryogenic electronics; field effect MIMIC; field effect analogue integrated circuits; integrated circuit noise; integrated circuit packaging; millimetre wave amplifiers; millimetre wave power amplifiers; reviews; submillimetre wave amplifiers; HBT; HEMT; cryogenic temperatures; heterojunction bipolar transistor circuits; high electron mobility transistor circuits; mHEMT; metamorphic HEMT amplifier circuits; noise figures; overview; packaging techniques; power amplifier technologies; review; solid-state integrated circuit amplifiers; terahertz frequencies; ultralow-noise; waveguide modules; Heterojunction bipolar transistors; Indium phosphide; Logic gates; Substrates; mHEMTs; Cryogenic electronics; HBTs; HEMTs; MMICs; THz; low-noise amplifiers; submillimeter-wave;
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
DOI :
10.1109/TTHZ.2011.2159558