DocumentCode :
1310903
Title :
Postfabrication Electrical Trimming of Silicon Micromechanical Resonators via Joule Heating
Author :
Samarao, Ashwin K. ; Ayazi, Farrokh
Author_Institution :
Integrated Device Technol., Inc., San Jose, CA, USA
Volume :
20
Issue :
5
fYear :
2011
Firstpage :
1081
Lastpage :
1088
Abstract :
This paper presents a method to electrically trim the resonance frequency of a silicon bulk acoustic resonator (SiBAR) after its fabrication is completed. The small volume of the microresonator can be Joule heated to a sufficiently high temperature to allow for diffusion of deposited metals from its surface onto its bulk. Such high temperatures also facilitate the formation of silicon-metal bonds which, depending on the metal, are either stronger or weaker compared to the existing silicon-silicon bonds. The former leads to an overall increased stiffness of the resonating element thereby trimming up its resonance frequency, while the latter does the opposite. Both trimming-up and trimming-down by ~400 kHz have been demonstrated at a resonance frequency of 100 MHz (i.e., trimming range of 4000 ppm) using gold and aluminum, respectively. The possibility of increasing the trimming range to ~4 MHz (i.e., 40 000 ppm) by engineering the resonator geometry is also discussed and demonstrated.
Keywords :
acoustic resonators; bulk acoustic wave devices; elemental semiconductors; microfabrication; micromechanical resonators; silicon; Joule heating; Si; frequency 100 MHz; microresonator; post fabrication electrical trimming; resonance frequency; resonator geometry; silicon bulk acoustic resonator; silicon micromechanical resonators; silicon-metal bonds; Aluminum; Gold; Heating; Resonant frequency; Silicon; Temperature measurement; Electrical trimming; Joule heating; postfabrication; thermomigration;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2011.2162489
Filename :
6006496
Link To Document :
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