DocumentCode
1313055
Title
Hybrid integration onto silicon motherboards with planar silica waveguides
Author
Jones, C.A. ; Cooper, K.
Author_Institution
British Telecom Res. Labs., Ipswich, UK
Volume
143
Issue
5
fYear
1996
fDate
10/1/1996 12:00:00 AM
Firstpage
316
Lastpage
321
Abstract
Silicon micromachining can be used in conjunction with silica on silicon waveguide technology to fabricate hybrid optical motherboards. These motherboards comprise optical and electrical interconnects, alignment features for integration of optoelectronic components and electronic circuitry. The development of the principal building blocks of an optical motherboard, and the fabrication of a hybrid integrated optical transceiver, are described
Keywords
hybrid integrated circuits; integrated optoelectronics; micromachining; optical fabrication; optical interconnections; optical planar waveguides; silicon; silicon compounds; silicon-on-insulator; transceivers; SiO2-Si; alignment features; electrical interconnects; electronic circuitry; hybrid integrated optical transceiver fabrication; hybrid integration; hybrid optical motherboard fabrication; optical interconnects; optoelectronic component integration; planar silica waveguides; principal building blocks; silica on silicon waveguide technology; silicon micromachining; silicon motherboards;
fLanguage
English
Journal_Title
Optoelectronics, IEE Proceedings -
Publisher
iet
ISSN
1350-2433
Type
jour
DOI
10.1049/ip-opt:19960731
Filename
556357
Link To Document