DocumentCode :
1313200
Title :
Strength characterization of silicon microprobes in neurophysiological tissues
Author :
Najafi, Khalil ; Hetke, Jamille F.
Author_Institution :
Dept. of Electr. & Comput. Sci., Michigan Univ., Ann Arbor, MI, USA
Volume :
37
Issue :
5
fYear :
1990
fDate :
5/1/1990 12:00:00 AM
Firstpage :
474
Lastpage :
481
Abstract :
Experimentally determined strength characteristics of thin-silicon probes in neural tissues are discussed. It is shown that by proper selection of the substrate length, width, and thickness, silicon substrates can be designed and used to penetrate a variety of biological tissues without breakage or excessive dimpling. Thin-silicon structures have a maximum fracture stress which is a factor of six larger than that of bulk silicon and are very flexible and capable of bending to angles larger than 90 degrees . Silicon substrates 15 mu m thick*30 mu m wide can easily penetrate guinea pig and rat pia arachnoid layers with minimum dimpling and no breakage, while substrates 30 mu m thick*80 mu m wide can penetrate guinea pig and rat dura mater repeatedly without breakage. Quantitative comparison on the relative toughness of neurophysiological tissues in rat and guinea pig have also been experimentally obtained.
Keywords :
biological techniques and instruments; neurophysiology; probes; silicon; Si microprobes; biological tissue penetration; breakage; dimpling; guinea pig; maximum fracture stress; neurophysiological tissues; neuroscience method; pia arachnoid layers; rat dura mater; strength characterization; Biological materials; Biological tissues; Dielectric films; Dielectric substrates; Fabrication; Microelectrodes; Neurophysiology; Probes; Silicon; Stress; Animals; Electric Conductivity; Equipment Design; Guinea Pigs; Materials Testing; Microelectrodes; Neurophysiology; Rats; Silicon;
fLanguage :
English
Journal_Title :
Biomedical Engineering, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9294
Type :
jour
DOI :
10.1109/10.55638
Filename :
55638
Link To Document :
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