DocumentCode :
1313362
Title :
Power enhancement of piezoelectric transformers by adding heat transfer equipment
Author :
Su, Yu-Hao ; Liu, Yuan-Ping ; Vasic, Dejan ; Wu, Wen-Jong ; Costa, François ; Lee, Chih-Kung
Author_Institution :
Syst. et Applic. des Technol. de l´´Inf. et de l´´Energie (SATIE), Ecole Normale Super. de Cachan, Cachan, France
Volume :
59
Issue :
10
fYear :
2012
fDate :
10/1/2012 12:00:00 AM
Firstpage :
2129
Lastpage :
2136
Abstract :
It is known that piezoelectric transformers have several inherent advantages compared with conventional electromagnetic transformers. However, the maximum power capacity of piezoelectric transformers is not as large as electromagnetic transformers in practice, especially in the case of high output current. The theoretical power density of piezoelectric transformers calculated by stress boundary can reach 330 W/cm3, but no piezoelectric transformer has ever reached such a high power density in practice. The power density of piezoelectric transformers is limited to 33 W/cm3 in practical applications. The underlying reason is that the maximum passing current of the piezoelectric material (mechanical current) is limited by the temperature rise caused by heat generation. To increase this current and the power capacity, we proposed to add a thermal pad to the piezoelectric transformer to dissipate heat. The experimental results showed that the proposed techniques can increase by 3 times the output current of the piezoelectric transformer. A theoretical-phenomenological model which explains the relationship between vibration velocity and generated heat is also established to verify the experimental results.
Keywords :
electric current; heat transfer; piezoelectric devices; piezoelectric materials; power transformers; temperature; heat dissipation; heat generation; heat transfer equipment; maximum power capacity; mechanical current; passing current; piezoelectric material; piezoelectric transformer; power density; power enhancement; stress boundary; temperature rise; thermal pad; vibration velocity; Cooling; Equivalent circuits; Heating; Power generation; Resistance; Temperature measurement; Vibrations;
fLanguage :
English
Journal_Title :
Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
Publisher :
ieee
ISSN :
0885-3010
Type :
jour
DOI :
10.1109/TUFFC.2012.2439
Filename :
6327485
Link To Document :
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