• DocumentCode
    1313362
  • Title

    Power enhancement of piezoelectric transformers by adding heat transfer equipment

  • Author

    Su, Yu-Hao ; Liu, Yuan-Ping ; Vasic, Dejan ; Wu, Wen-Jong ; Costa, François ; Lee, Chih-Kung

  • Author_Institution
    Syst. et Applic. des Technol. de l´´Inf. et de l´´Energie (SATIE), Ecole Normale Super. de Cachan, Cachan, France
  • Volume
    59
  • Issue
    10
  • fYear
    2012
  • fDate
    10/1/2012 12:00:00 AM
  • Firstpage
    2129
  • Lastpage
    2136
  • Abstract
    It is known that piezoelectric transformers have several inherent advantages compared with conventional electromagnetic transformers. However, the maximum power capacity of piezoelectric transformers is not as large as electromagnetic transformers in practice, especially in the case of high output current. The theoretical power density of piezoelectric transformers calculated by stress boundary can reach 330 W/cm3, but no piezoelectric transformer has ever reached such a high power density in practice. The power density of piezoelectric transformers is limited to 33 W/cm3 in practical applications. The underlying reason is that the maximum passing current of the piezoelectric material (mechanical current) is limited by the temperature rise caused by heat generation. To increase this current and the power capacity, we proposed to add a thermal pad to the piezoelectric transformer to dissipate heat. The experimental results showed that the proposed techniques can increase by 3 times the output current of the piezoelectric transformer. A theoretical-phenomenological model which explains the relationship between vibration velocity and generated heat is also established to verify the experimental results.
  • Keywords
    electric current; heat transfer; piezoelectric devices; piezoelectric materials; power transformers; temperature; heat dissipation; heat generation; heat transfer equipment; maximum power capacity; mechanical current; passing current; piezoelectric material; piezoelectric transformer; power density; power enhancement; stress boundary; temperature rise; thermal pad; vibration velocity; Cooling; Equivalent circuits; Heating; Power generation; Resistance; Temperature measurement; Vibrations;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2012.2439
  • Filename
    6327485