DocumentCode :
131337
Title :
Device-circuit co-design and comparison of ultra-low voltage Tunnel-FET and CMOS digital circuits
Author :
Esseni, David ; Alioto, Massimo
Author_Institution :
DIEGM, Univ. of Udine, Udine, Italy
fYear :
2014
fDate :
22-25 June 2014
Firstpage :
321
Lastpage :
324
Abstract :
This paper presents a comparative study between Tunnel-FETs (TFETs) and SOI MOSFETs for ultra-low power digital circuits targeting ultra-low voltages (below 500mV). We illustrateg a device-circuit co-design of n- and p-type Tunnel FETs leading to a good tradeoff between current leakage, effective capacitance and transistor imbalance at ultra-low VDD. TFETs and MOSFETs at 30 nm gate length are compared in terms of DC robustness, effect of transistor stacking, performance and potential for minimum-energy operation under aggressive voltage scaling.
Keywords :
CMOS digital integrated circuits; MOSFET; integrated circuit design; leakage currents; low-power electronics; semiconductor device models; tunnel transistors; CMOS digital circuits; DC robustness; SOI MOSFET; Si; aggressive voltage scaling; current leakage; device-circuit co-design; effective capacitance; minimum-energy operation; n-tunnel FET; p-type tunnel FET; size 30 nm; transistor imbalance; transistor stacking effect; ultra-low power digital circuits; ultra-low voltage tunnel-FET; Capacitance; Doping; Logic gates; MOSFET; Robustness; Device-circuit co-design; VLSI; tunnel FET; ultra-low power; ultra-low voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
New Circuits and Systems Conference (NEWCAS), 2014 IEEE 12th International
Conference_Location :
Trois-Rivieres, QC
Type :
conf
DOI :
10.1109/NEWCAS.2014.6934047
Filename :
6934047
Link To Document :
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