DocumentCode :
1314083
Title :
Latency Insertion Method (LIM) for DC Analysis of Power Supply Networks
Author :
Klokotov, Dmitri ; Goh, Patrick ; Schutt-Ainé, José E.
Author_Institution :
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
Volume :
1
Issue :
11
fYear :
2011
Firstpage :
1839
Lastpage :
1845
Abstract :
Process scaling in modern integrated circuits has led to multiple signal and power integrity issues. In particular, ensuring reliable performance of on-chip power delivery systems has become a major design challenge. Rigorous analysis and simulations are required at the design stage to ensure proper functionality of an on-chip power supply. This puts a strain on existing numerical tools due to the sheer size of the power grids. In this paper, a fast circuit simulation technique based on the latency insertion method (LIM) is proposed for the steady-state analysis of large-scale circuits, such as on-chip power distribution network. The proposed method is shown to be very efficient for modeling of networks with very large numbers of nodes. The comparison with one of the well-established methods used for the power grid analysis today, the Random-Walk algorithm, shows that LIM is almost two orders of magnitude faster.
Keywords :
circuit simulation; distribution networks; power grids; power supply circuits; DC analysis; circuit simulation; large-scale circuit; latency insertion method; modern integrated circuit; on-chip power delivery system; on-chip power distribution network; power grid analysis; power supply network; process scaling; random-walk algorithm; steady-state analysis; Computational modeling; Integrated circuit modeling; Mathematical model; Power grids; Steady-state; Transient analysis; DC analysis; IR-drop; latency insertion; latency insertion method; power distribution network; power integrity; power supply;
fLanguage :
English
Journal_Title :
Components, Packaging and Manufacturing Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-3950
Type :
jour
DOI :
10.1109/TCPMT.2011.2162838
Filename :
6009178
Link To Document :
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