• DocumentCode
    1314202
  • Title

    Superconducting joint between Bi-Pb-Sr-Ca-Cu-O superconductor tapes

  • Author

    Jung Ho Kim ; Bong Ki Ji ; Jinho Joo ; Cheol-Woong Yang ; Wansoo Nah

  • Author_Institution
    Sch. of Metall. & Mater. Eng., Sungkyunkwan Univ., Suwon, South Korea
  • Volume
    10
  • Issue
    1
  • fYear
    2000
  • fDate
    3/1/2000 12:00:00 AM
  • Firstpage
    1182
  • Lastpage
    1185
  • Abstract
    We evaluated the effects of joining processes such as contact method, shape of joined area and pressure on the electrical and mechanical properties of Bi-2223 superconducting tape. Specifically, the current carrying capacity and bonding strength of the lap-joined tape were measured as a function of uniaxial pressure and correlated to the microstructural evolution. It was observed that the current carrying capacity was reduced in the transition region of the jointed tape and was significantly dependent on the uniaxial pressure. The jointed tape, fabricated with a pressure of 1,600 MPa, showed the highest value of current capacity 90% of the tape itself. It is believed that the highest value of current capacity results from improvements in core density, contacting area and grain alignment. In addition, bonding strength of the jointed tape was evaluated and correlated to the microstructural evolution.
  • Keywords
    bismuth compounds; calcium compounds; high-temperature superconductors; joining processes; lead compounds; strontium compounds; superconducting tapes; Bi-Pb-Sr-Ca-Cu-O; Bi-Pb-Sr-Ca-Cu-O superconductor tapes; bonding strength; contact method; high temperature superconductor; joined area shape; joining processes; microstructural evolution; superconducting joint; uniaxial pressure; Bonding; Critical current; Critical current density; Independent component analysis; Petroleum; Powders; Superconducting filaments and wires; Superconducting films; Switches; Transformers;
  • fLanguage
    English
  • Journal_Title
    Applied Superconductivity, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1051-8223
  • Type

    jour

  • DOI
    10.1109/77.828445
  • Filename
    828445