DocumentCode :
1314346
Title :
A high strength, high conductivity, low radiation activation nanocomposite
Author :
Renaud, C.
Author_Institution :
Supercon Inc., Shrewsbury, MA, USA
Volume :
10
Issue :
1
fYear :
2000
fDate :
3/1/2000 12:00:00 AM
Firstpage :
1273
Lastpage :
1276
Abstract :
A high strength, high conductivity nanocomposite material, consisting of ultrafine, discontinuous vanadium filaments reinforcing a copper matrix, has been developed. This metal matrix composite possesses the same outstanding combination of strength and conductivity as does the more familiar CuNb nanocomposite. Tensile strengths in excess of 1.6 GPa were obtained in wire and 1 GPa in sheet. A significant amount of strength was retained after exposure to temperatures of up to 400/spl deg/C. Fatigue test results show that the material can withstand stress about equal to the 0.2% yield strength for thousands of cycles. Mechanical testing of sheet samples indicates that elongation to failure is approximately 40% greater than in CuNb for equivalent strength levels. While this material was principally developed for high heat flux, high radiation environments such as first walls and divertor structures in fusion reactors, its excellent high stress fatigue properties also make it a very promising material for high field magnet applications.
Keywords :
copper; elongation; fatigue; fibre reinforced composites; nanostructured materials; tensile strength; vanadium; yield strength; V-Cu; copper matrix; discontinuous vanadium filaments; fatigue test; fusion reactor divertor structures; high strength high conductivity material; low radiation activation nanocomposite; metal matrix composite; tensile strength; yield strength; Conducting materials; Conductivity; Copper; Fatigue; Magnetic materials; Materials testing; Nanostructured materials; Sheet materials; Temperature; Wire;
fLanguage :
English
Journal_Title :
Applied Superconductivity, IEEE Transactions on
Publisher :
ieee
ISSN :
1051-8223
Type :
jour
DOI :
10.1109/77.828467
Filename :
828467
Link To Document :
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