Restoration mechanisms in highly deformed Cu-based conductor wires

Author

Kalu, P.N. ; Waryoba, D.R. ; van Sciver, S. ; Brandao, L.

Author_Institution

FAMU-FSU Coll. of Eng., NHMFL, Tallahassee, FL, USA

Volume

10

Issue

1

fYear

2000

fDate

3/1/2000 12:00:00 AM

Firstpage

1296

Lastpage

1299

Abstract

Conductor wires used in pulsed magnets are traditionally fabricated by wire drawing. The strength of the conductors is influenced by the microstructure, which is partly dependent on the restoration mechanisms occurring during processing. This study provides an insight into the types of restoration mechanisms occurring during wire drawing of OFHC copper. The effects of the restoration mechanisms on the mechanical and electrical properties of the material were determined. Tensile tests revealed the existence of steady state stress followed by strength softening at large processing strain. Optical and orientation imaging microscopy (OIM) showed that the strength softening coincided with the onset of recrystallization in the material. Although restoration mechanisms of recovery and recrystallization played some role in the strengthening they had little or no effect on the resistivity of the material.

Keywords

copper; crystal microstructure; drawing (mechanical); internal stresses; optical microscopy; recrystallisation; tensile strength; Cu; OFHC copper; highly deformed conductor wires; microstructure; orientation imaging microscopy; pulsed magnets; recrystallization; restoration mechanisms; steady state stress; strength softening; tensile test; wire drawing; Conducting materials; Conductors; Copper; Magnets; Microstructure; Optical materials; Optical microscopy; Softening; Tensile stress; Wire drawing;

fLanguage

English

Journal_Title

Applied Superconductivity, IEEE Transactions on

Publisher

ieee

ISSN

1051-8223

Type

jour

DOI

10.1109/77.828473

Filename

828473