• DocumentCode
    1314911
  • Title

    Bridging and Bonding in Exchange Networks: A Structural Embeddedness Perspective of B2B Digital Intermediation

  • Author

    Tang, Xinlin ; Rai, Arun ; Wareham, Jonathan

  • Author_Institution
    Coll. of Bus., Florida State Univ., Tallahassee, FL, USA
  • Volume
    58
  • Issue
    1
  • fYear
    2011
  • Firstpage
    4
  • Lastpage
    20
  • Abstract
    We adopt a structural embeddedness perspective to explore how network structure shapes the type of value-creation opportunities that digital intermediaries can exploit and to understand the capabilities that they require to be successful in the context of different network structures. Through two comparative case studies, we find that different tie architectures and exchange structures form the push forces to shape the opportunities for digital intermediaries. Based on the type of network position they intend to occupy, digital intermediaries can increase their chance of success by developing distinct capabilities for bridging and/or bonding. The two cases also show that bridging benefits may be easier to obtain but harder to defend and scale, while bonding benefits are harder to obtain but easier to defend and scale. The findings are used to develop theoretical propositions related to successful digital intermediation in different network structures.
  • Keywords
    Internet; business data processing; B2B digital intermediation; bonding; bridging; exchange networks; structural embeddedness perspective; value-creation opportunities; Companies; Consumer electronics; Context; Economics; Industries; Resins; Shape; Bonding; bridging; digital intermediation; structural embeddedness;
  • fLanguage
    English
  • Journal_Title
    Engineering Management, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9391
  • Type

    jour

  • DOI
    10.1109/TEM.2010.2058852
  • Filename
    5565434