DocumentCode :
1314968
Title :
Arbitrary convex and concave rectilinear block packing using sequence-pair
Author :
Fujiyoshi, Kunihiro ; Murata, Hiroshi
Author_Institution :
Dept. of Electron. Eng., Tokyo Univ. of Agric. & Technol., Japan
Volume :
19
Issue :
2
fYear :
2000
fDate :
2/1/2000 12:00:00 AM
Firstpage :
224
Lastpage :
233
Abstract :
The sequence-pair was proposed in 1995 as a representation of the packing of rectangles of general structure. Since then, there have been efforts to expand its applicability over simple rectangles. This paper proposes a unified way to represent the packing of a set of rectilinear blocks, including arbitrary concave rectilinear blocks. Our idea is in the representation of a general block by a collection of rectangle blocks with additional constraints, Some sequence-pairs of rectangle blocks with such constraints may not be feasible, i.e., there is no corresponding parking. A necessary and sufficient condition of feasible sequence-pair is given by the properties of the horizontal and vertical constraint graphs. Furthermore, it is proved that any packing is represented by a feasible sequence-pair. The condition includes dimensions of blocks involved. If we limit the rectilinear blocks to L-shaped ones, a necessary and sufficient condition can be represented only in terms of the topology of the sequence-pair, without dimensions of blocks. A packing algorithm is designed as an SA search of the generated sequence-pairs. Experimental results show the effectiveness of the proposed method
Keywords :
VLSI; circuit layout CAD; graph theory; integrated circuit layout; VLSI layout; concave rectilinear block packing; convex rectilinear block packing; horizontal constraint graph; packing algorithm; rectangles; sequence-pair; vertical constraint graph; Agricultural engineering; Agriculture; Algorithm design and analysis; Associate members; Stochastic processes; Sufficient conditions; Topology; Very large scale integration;
fLanguage :
English
Journal_Title :
Computer-Aided Design of Integrated Circuits and Systems, IEEE Transactions on
Publisher :
ieee
ISSN :
0278-0070
Type :
jour
DOI :
10.1109/43.828551
Filename :
828551
Link To Document :
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