• DocumentCode
    1315335
  • Title

    Composition Dependence of Structural and Magnetic Properties of Electrodeposited Co-Cu Films

  • Author

    Karaagac, Oznur ; Kockar, Hakan ; Alper, Mursel

  • Author_Institution
    Phys. Dept., Balikesir Univ., Balkesir, Turkey
  • Volume
    46
  • Issue
    12
  • fYear
    2010
  • Firstpage
    3973
  • Lastpage
    3977
  • Abstract
    The structural and magnetic properties of Co-Cu films were studied in terms of Co content in the films. The surface morphology of the films showed that the film with the lowest Co content (3 wt. %) had dendritic structures, whereas the surface of the film containing the highest amount of Co (61 wt. %) was more uniform with acicular shapes in some parts. X-ray diffraction patterns of the films showed that their crystal structure is a mixture of dominantly face-centered cubic (fcc) and hexagonal close-packed phases. At the lowest Co content, separate fcc (111) peaks appear, whereas the increase of Co content converts the peaks to be a single broad Co-Cu peak. The vibrating sample magnetometer measurements revealed that the saturation magnetization increases and coercivity decreases due to the decrease of the grain size caused by the increase of the Co content in the film. The structural and magnetic properties of Co-Cu films can be tailored, since these properties are directly related to the ratio of Co to Cu in the film.
  • Keywords
    X-ray diffraction; cobalt alloys; coercive force; copper alloys; dendritic structure; electrodeposits; magnetic thin films; magnetisation; magnetometers; surface morphology; CoCu; X-ray diffraction; coercivity; crystal structure; dendritic structures; electrodeposited films; face-centered cubic; grain size; saturation magnetization; surface morphology; vibrating sample magnetometer; Coercive force; Copper; Films; Grain size; Magnetic multilayers; Magnetic properties; Substrates; Cobalt alloys; electrochemical process; magnetic analysis;
  • fLanguage
    English
  • Journal_Title
    Magnetics, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9464
  • Type

    jour

  • DOI
    10.1109/TMAG.2010.2073479
  • Filename
    5565500