• DocumentCode
    131611
  • Title

    Process Reliability Data Comparison Guidance and Practise in Advanced Semiconductor Manufacturing Quality Control

  • Author

    Dulin Wang ; Kang, Ren ; Ming Li ; Ma, Jiaxin ; Wu, Junyong ; Chein, Wei-Ting Kary

  • Author_Institution
    Semicond. Manuf. Int. Corp., Shanghai, China
  • fYear
    2014
  • fDate
    10-11 Jan. 2014
  • Firstpage
    455
  • Lastpage
    458
  • Abstract
    This paper introduces a guidance, which is displayed by a flow chart, for the process reliability data comparison of advanced semiconductor technologies. The present semiconductor manufacturing process is very complex and its quality control requirement also becomes more and more strict. Different reliability data may analyzed by different methods considering both engineering and statistical evidence so we can best assess process reliability performance not only considering the lifetime requirements. Engineering comparison method is based on fitting the reliability data with proper distribution or lifetime model and comparing the lifetime at a specified condition with 95% confidence band. We apply F-T test for two groups data and one-way ANOVA for multi-groups statistical comparisons. Practical examples are given to illustrate our proposed guidance flow.
  • Keywords
    quality control; semiconductor device manufacture; semiconductor device reliability; statistical analysis; ANOVA; F-T test; advanced semiconductor manufacturing quality control; engineering comparison method; flow chart; lifetime model; multigroups statistical comparison; process reliability data comparison guidance; statistical evidence; Analysis of variance; Human computer interaction; Process control; Quality control; Reliability engineering; Synthetic aperture sonar; comparison guidance; engineering judgment; quality control; reliability tests; statistic comparison;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Measuring Technology and Mechatronics Automation (ICMTMA), 2014 Sixth International Conference on
  • Conference_Location
    Zhangjiajie
  • Print_ISBN
    978-1-4799-3434-8
  • Type

    conf

  • DOI
    10.1109/ICMTMA.2014.112
  • Filename
    6802729