Title :
Reliability Analysis of Small-Delay Defects Due to Via Narrowing in Signal Paths
Author :
Villacorta, Hector ; Hawkins, Chuck ; Champac, Victor ; Segura, Jaume ; Gomez, Roberto
Author_Institution :
Nat. Inst. for Astrophys., Opt. & Electron. (INAOE), Puebla, Mexico
Abstract :
The number of open defects in vias has increased with the introduction of the copper process, smaller geometries, and via counts in the order of billions for modern integrated circuits. The authors investigate reliability risks by estimating the Median Time to Failure (MTF) as a function of the void size in vias placed. The number of open defects in vias has increased with the introduction of the copper process, smaller geometries, and via counts in the order of billions for modern integrated circuits. The authors investigate reliability risks by estimating the Median Time to Failure (MTF) as a function of the void size in vias placed on signal paths.
Keywords :
copper; delay circuits; integrated circuit reliability; Cu; MTF; copper process; integrated circuits; median time to failure; open defects; reliability analysis; reliability risks; signal paths; small-delay defects; smaller geometries; via counts; via narrowing; void size; Current density; Electromigration; Failure analysis; Nanoscale devices; Reliability; Resistance; Blacks Law; Electromigration; Resistive Opens; Small Delay Defect; Via Duplication; Via Reliability;
Journal_Title :
Design & Test, IEEE
DOI :
10.1109/MDT.2013.2238578
