Title :
High voltage GaN Schottky rectifiers
Author :
Dang, Gerard T. ; Zhang, Anping P. ; Ren, Fan ; Cao, Xianan A. ; Pearton, Stephen J. ; Cho, Hyun ; Han, Jung ; Chyi, Jenn-Inn ; Lee, C.M. ; Chuo, C.C. ; Chu, S.N.George ; Wilson, Robert G.
Author_Institution :
Dept. of Chem. Eng., Florida Univ., Gainesville, FL, USA
fDate :
4/1/2000 12:00:00 AM
Abstract :
Mesa and planar GaN Schottky diode rectifiers with reverse breakdown voltages (VRB) up to 550 and >2000 V, respectively, have been fabricated. The on-state resistance, RON , was 6 mΩ·cm2 and 0.8 Ω cm2 , respectively, producing figure-of-merit values for (VRB )2/RON in the range 5-48 MW·cm-2 . At low biases the reverse leakage current was proportional to the size of the rectifying contact perimeter, while at high biases the current was proportional to the area of this contact. These results suggest that at low reverse biases, the leakage is dominated by the surface component, while at higher biases the bulk component dominates. On-state voltages were 3.5 V for the 550 V diodes and ⩾15 for the 2 kV diodes. Reverse recovery times were <0.2 μs for devices switched from a forward current density of ~500 A·cm-2 to a reverse bias of 100 V
Keywords :
Schottky diodes; gallium compounds; leakage currents; power semiconductor diodes; semiconductor device breakdown; solid-state rectifiers; wide band gap semiconductors; 2 kV; 550 V; GaN; Schottky diode rectifiers; dry etching; figure-of-merit values; high bias; high voltage; low bias; mesa Schottky rectifiers; on-state resistance; on-state voltages; planar Schottky rectifiers; power electronics; rectifying contact area; rectifying contact perimeter size; reverse breakdown voltage; reverse leakage current; reverse recovery times; Drives; Dry etching; Forward contracts; Gallium nitride; Photonic band gap; Power electronics; Rectifiers; Schottky diodes; Semiconductor diodes; Voltage;
Journal_Title :
Electron Devices, IEEE Transactions on