Title :
An Analytical Expression for Charge Collection Probability From Within a U-Shaped Junction Well
Author :
Tan, Chee Chin ; Ong, Vincent K.S.
Author_Institution :
Sch. of Electr. & Electron. Eng., Nanyang Technol. Univ., Singapore, Singapore
Abstract :
The analytical expression for the charge collection probability within a U-shaped junction well is derived in this paper. The U-shaped junction well is a common feature found in most integrated circuits. The charge collection probability is the probability that the generated carrier will be collected at the charge-collecting junction. The availability of an analytical expression is expected to facilitate the study and development of the electron-beam-induced current technique and devices that share the same operating principle, e.g., the solar cell. The newly derived analytical expression is expected to avoid the computational difficulties and problems encountered using the currently available analytical expression. The charge collection probability profiles that were generated using a semiconductor device simulator program were used to verify the analytical profiles that were computed using the newly derived analytical expression. Good agreement was found. The junction depth, junction width, diffusion length, and depth of the generation volume were varied, and their effects were studied.
Keywords :
EBIC; electron beam applications; scanning electron microscopy; semiconductor quantum wells; U-shaped junction well; analytical expression; analytical profiles; charge collection probability profiles; charge-collecting junction; diffusion length; electron-beam-induced current devices; electron-beam-induced current technique; generation volume depth; integrated circuits; junction depth; junction width; semiconductor device simulator program; Charge carrier processes; Electron beam applications; Green´s function methods; Junctions; Semiconductor device measurement; Simulation; Charge-carrier processes; electron beam application; semiconductor material measurements; simulation;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/TED.2010.2068451