• DocumentCode
    1317686
  • Title

    Transistor characteristics of 14-nm-gate-length EJ-MOSFETs

  • Author

    Kawaura, Hisao ; Sakamoto, Toshitsugu ; Baba, Toshio ; Ochiai, Yukinori ; Fujita, Jun´ichi ; Sone, Jun´ichi

  • Author_Institution
    Fundamental Res. Labs., NEC Corp., Ibaraki, Japan
  • Volume
    47
  • Issue
    4
  • fYear
    2000
  • fDate
    4/1/2000 12:00:00 AM
  • Firstpage
    856
  • Lastpage
    860
  • Abstract
    We have fabricated electrically variable shallow junction metal-oxide-silicon field-effect transistors (EJ-MOSFETs) to investigate transport characteristics of ultrafine gate MOSFETs. By using EB direct writing on an ultrahigh-resolution negative resist (calixarene), we could achieved a gate length of only 14 nm. Despite such an ultrafine gate, the device exhibited transistor operation at room temperature. From studying the devices with the gate lengths from 14 nm to 98 nm, we found that when the gate length was below 30 nm the subthreshold leakage current increased. The low-temperature measurements showed that the leakage current was caused by the classical thermal process and that quantum effects do not play an important role in subthreshold characteristics at room temperature
  • Keywords
    MOSFET; electron beam lithography; leakage currents; 14 to 98 nm; EB direct writing; EJ-MOSFET; calixarene; classical thermal process; electrically variable shallow junction; low-temperature measurements; room temperature operation; subthreshold leakage current; transistor characteristics; transport characteristics; ultrafine gate MOSFET; ultrahigh-resolution negative resist; Current measurement; FETs; Laboratories; Leakage current; MOSFET circuits; National electric code; Resists; Subthreshold current; Temperature dependence; Writing;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.831004
  • Filename
    831004