DocumentCode
1317686
Title
Transistor characteristics of 14-nm-gate-length EJ-MOSFETs
Author
Kawaura, Hisao ; Sakamoto, Toshitsugu ; Baba, Toshio ; Ochiai, Yukinori ; Fujita, Jun´ichi ; Sone, Jun´ichi
Author_Institution
Fundamental Res. Labs., NEC Corp., Ibaraki, Japan
Volume
47
Issue
4
fYear
2000
fDate
4/1/2000 12:00:00 AM
Firstpage
856
Lastpage
860
Abstract
We have fabricated electrically variable shallow junction metal-oxide-silicon field-effect transistors (EJ-MOSFETs) to investigate transport characteristics of ultrafine gate MOSFETs. By using EB direct writing on an ultrahigh-resolution negative resist (calixarene), we could achieved a gate length of only 14 nm. Despite such an ultrafine gate, the device exhibited transistor operation at room temperature. From studying the devices with the gate lengths from 14 nm to 98 nm, we found that when the gate length was below 30 nm the subthreshold leakage current increased. The low-temperature measurements showed that the leakage current was caused by the classical thermal process and that quantum effects do not play an important role in subthreshold characteristics at room temperature
Keywords
MOSFET; electron beam lithography; leakage currents; 14 to 98 nm; EB direct writing; EJ-MOSFET; calixarene; classical thermal process; electrically variable shallow junction; low-temperature measurements; room temperature operation; subthreshold leakage current; transistor characteristics; transport characteristics; ultrafine gate MOSFET; ultrahigh-resolution negative resist; Current measurement; FETs; Laboratories; Leakage current; MOSFET circuits; National electric code; Resists; Subthreshold current; Temperature dependence; Writing;
fLanguage
English
Journal_Title
Electron Devices, IEEE Transactions on
Publisher
ieee
ISSN
0018-9383
Type
jour
DOI
10.1109/16.831004
Filename
831004
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