Circuits and devices: High-frequency components play catch-up: From RF to mm waves, improved circuit and packaging techniques have increased the density and performance of the latest components

Thwarted by low product volume, high prices, and little movement to standardization, designers of RF and higher-frequency systems have become accustomed to seeing the spotlight fall on their lower-frequency counterparts. Nevertheless, these high-frequency designers have been engaged in a vigorous assault on the fundamental limitations of their technology — and have achieved some spectacular results.