DocumentCode :
1318579
Title :
Thermal stability of Pd-In ohmic contacts to n-GaAs formed by scanned electron beam and rapid thermal annealing
Author :
Prasad, K. ; Faraone, L. ; Nassibian, A.G.
Author_Institution :
Dept. of Electr. & Electron. Eng., Western Australia Univ., Nedlands, WA, Australia
Volume :
27
Issue :
2
fYear :
1991
Firstpage :
149
Lastpage :
151
Abstract :
Thermally stable and low resistance Pd-In ohmic contacts to n-GaAs were formed using scanned electron beam (SEB) and rapid thermal annealing (RTA). A specific contact resistance ( rho c) of the order of approximately 10-6 Omega cm2 was obtained using both SEB and RTA techniques with SEB annealed contacts exhibiting a superior surface morphology. High temperature aging (500 degrees C) of the contacts showed that SEB annealed contacts were more stable than RTA contacts as shown by the increase in their respective rho c values (an increase by a factor of approximately 5 for SEB annealed contacts against an increase by a factor of approximately 8 for RTA contacts after 25 hour s of aging).
Keywords :
III-V semiconductors; ageing; annealing; contact resistance; electron beam annealing; gallium arsenide; indium; metallisation; ohmic contacts; palladium; semiconductor-metal boundaries; 25 hrs; 500 degC; GaAs; Pd-In-GaAs; annealed contacts; high temperature ageing; low resistance Pd-In ohmic contacts; multilayer metallisation; n-GaAs; rapid thermal annealing; scanned electron beam annealing; specific contact resistance; surface morphology; thermal stability;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19910097
Filename :
83172
Link To Document :
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