• DocumentCode
    1320067
  • Title

    Foreword contributions from the ITherm´98 to thermal management

  • Author

    Lee, T.-Y.T. ; Ramakrishna, K. ; Amon, C.H.

  • Author_Institution
    Motorola, Inc.
  • Volume
    23
  • Issue
    1
  • fYear
    2000
  • fDate
    3/1/2000 12:00:00 AM
  • Firstpage
    3
  • Lastpage
    5
  • Keywords
    Electronic packaging thermal management; Electronics cooling; Heat sinks; Heat transfer; Multichip modules; Temperature sensors; Thermal management; Thermal management of electronics; Thermomechanical processes; Trigeneration;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2000.833035
  • Filename
    833035
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1320067