Title :
Fundamental investigation of roll bond heat pipe as heat spreader plate for notebook computers
Author :
Take, Koichiro ; Furukawa, Yuichi ; Ushioda, Shunta
Author_Institution :
Dept. of Res. & Dev., Showa Aluminum Corp., Tochigi, Japan
fDate :
3/1/2000 12:00:00 AM
Abstract :
A roll bond heat pipe (RBHP) is very promising in the cooling of electronic equipment such as notebook computers. This study presents prediction data on maximum capillary limit obtained for the RBHP with 7.8 mm wide flow channel. Further, experimental study has been conducted to show the difference between the highest and lowest temperatures on the RBHP. These data determine the optimum working fluid charge volume and number of capillary loops for the RBHP
Keywords :
cooling; heat pipes; notebook computers; thermal management (packaging); capillary flow; electronic cooling; heat spreader plate; notebook computer; roll bond heat pipe; Aluminum; Bonding; Contact resistance; Electronics cooling; Friction; Hydraulic diameter; Microcomputers; Permeability; Resistance heating; Temperature;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/6144.833045
