DocumentCode :
1320142
Title :
Heat-pipes for electronic devices and evaluation of their thermal performance
Author :
Namba, Kenichi ; Niekawa, Jun ; Kimura, Yuichi ; Hashimoto, Nobuyuki
Author_Institution :
R&D Labs., Farukawa Electr. Co. Ltd., Yokohama, Japan
Volume :
23
Issue :
1
fYear :
2000
fDate :
3/1/2000 12:00:00 AM
Firstpage :
91
Lastpage :
94
Abstract :
This paper reports on the performance of miniature heat-pipes developed for cooling of electronic equipment, and on evaluating the notebook computer cooling systems in which they are used. Experiments for the miniature heat-pipe were conducted on their thermal properties and reliability. The results indicate the miniature heat-pipe can be applied to electronic equipment cooling. Evaluating tests of the cooling system using this miniature heat-pipe have clarified the effectiveness of the miniature heat-pipe
Keywords :
cooling; heat pipes; notebook computers; reliability; cooling; electronic equipment; evaluating tests; heat-pipes; notebook computer; reliability; thermal performance; thermal properties; Electronic equipment; Electronics cooling; Heat transfer; Microcomputers; Resistance heating; Space heating; System testing; Temperature; Thermal conductivity; Thermal resistance;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/6144.833047
Filename :
833047
Link To Document :
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