Full software analysis and impedance matching of radio frequency CMOS integrated circuits

Author

Kim, Ki Hyuk ; Chung, Hoi Ju ; Yoon, Sung Ho ; Hwang, Sung Woo ; Park, Jinwoo ; Kim, Soo-Won ; Choi, Joongho ; Ahn, Doyeol

Author_Institution

Dept. of Electron. Eng., Korea Univ., Seoul, South Korea

Volume

23

Issue

1

fYear

2000

fDate

3/1/2000 12:00:00 AM

Firstpage

183

Lastpage

189

Abstract

We present a systematic analysis technique of complementary metal-oxide-semiconductor (CMOS) radio-frequency (RF) integrated circuits (ICs). A full simulation program with integrated circuit emphasis (SPICE) simulation of the whole chip including the package and the die, with the parameters extracted from purely software analysis, has been performed. It is shown that the RF impedance matching without S-parameter based techniques is possible and the measured results agree well with our SPICE-only software based technique

Keywords

CMOS integrated circuits; SPICE; UHF integrated circuits; circuit simulation; field effect MMIC; impedance matching; integrated circuit interconnections; integrated circuit packaging; SPICE simulation; die; impedance matching; package; radio frequency CMOS integrated circuits; software analysis; Analytical models; CMOS integrated circuits; Circuit simulation; Impedance matching; Integrated circuit packaging; Radio frequency; Radiofrequency integrated circuits; SPICE; Software packages; Software performance;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/6144.833059

Filename

833059