DocumentCode
1322686
Title
Aging Effects in Gold Thermocompression Bonds to Complex Metallizations
Author
Anderson, J.H., Jr. ; Maple, T.Grant ; Cox, William P.
Author_Institution
Lockheed Palo Alto Research Laboratory, Palo Alto, Calif.; University of Rochester, Rochester, N.Y.
Issue
1
fYear
1970
Firstpage
32
Lastpage
34
Abstract
The times to failure of Au thermocompression bonds to Au-Mo-Al and to Au-Ti-Al multilayer films were determined as a function of temperature over the range of 125-400°C and compared with the time to failure of gold bonds to aluminum films. A 500-Ã
Ti intermediate film was found to be ineffective as a barrier to reaction between gold and aluminum. On the other hand, a 500-Ã
Mo film was effective, providing increased time to failure over that observed for bonds to Au-Ti-Al and Al films. No failures were observed after 2000 hours at 400°C when gold wire bonds were made to an Au/Mo/Al metallization having 1000 Ã
of molybdenum as the intermediate layer.
Keywords
Aging; Aluminum; Bonding; Gold; Integrated circuit interconnections; Integrated circuit metallization; Semiconductor films; Silicon; Titanium; Wire;
fLanguage
English
Journal_Title
Reliability, IEEE Transactions on
Publisher
ieee
ISSN
0018-9529
Type
jour
DOI
10.1109/TR.1970.5216376
Filename
5216376
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