DocumentCode
132293
Title
Investigation of 600 V GaN HEMTs for high efficiency and high temperature applications
Author
Zhuxian Xu ; Weimin Zhang ; Fan Xu ; Wang, F. ; Tolbert, Leon M. ; Blalock, Benjamin J.
Author_Institution
Center for Ultra-wide-area Resilient Electr. Energy Transm. Networks, Univ. of Tennessee, Knoxville, TN, USA
fYear
2014
fDate
16-20 March 2014
Firstpage
131
Lastpage
136
Abstract
This paper investigates the fast switching characteristics and high temperature performance of the emerging 600 V GaN high-electron-mobility transistor (HEMT) for high efficiency / high temperature applications. First, the inherent switching performance of the GaN HEMT is demonstrated in the double pulse test. The GaN HEMT exhibits superior switching capability, with a di/dt reaching 9.6 A/ns and dv/dt reaching 140 V/ns. Then, the limitations of the fast switching capability by the device packaging and application circuit are analyzed. The interference between the current and gate through common source inductance limits the inherent switching speed. Packaging and circuit layout with small parasitics is critical in achieving fast switching. Finally, the high temperature static and switching characteristics up to 200 °C are also tested and given. The switching performance of the device is temperature insensitive.
Keywords
III-V semiconductors; gallium compounds; high electron mobility transistors; semiconductor device packaging; wide band gap semiconductors; GaN; HEMTs; application circuit; circuit layout; common source inductance; device packaging; fast switching characteristics; high temperature applications; high-electron-mobility transistor; switching speed; voltage 600 V; Gallium nitride; HEMTs; Logic gates; MODFETs; Switches; Switching circuits; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Applied Power Electronics Conference and Exposition (APEC), 2014 Twenty-Ninth Annual IEEE
Conference_Location
Fort Worth, TX
Type
conf
DOI
10.1109/APEC.2014.6803299
Filename
6803299
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