• DocumentCode
    1323026
  • Title

    Reliability of Embedded Planar Capacitors With Epoxy– \\hbox {BaTiO}_{3} Composite Dielectric During Temperature–Humidity–Bias Tests

  • Author

    Alam, Mohammed A. ; Azarian, Michael H. ; Pecht, Michael G.

  • Author_Institution
    Center for Adv. Life Cycle Eng., Univ. of Maryland, College Park, MD, USA
  • Volume
    12
  • Issue
    1
  • fYear
    2012
  • fDate
    3/1/2012 12:00:00 AM
  • Firstpage
    86
  • Lastpage
    93
  • Abstract
    In this work, the reliability of an embedded planar capacitor with epoxy-BaTiO3 composite dielectric was investigated under temperature-humidity-bias (THB) conditions. The temperature and humidity conditions were selected as 85°C and 85% RH, respectively. In order to investigate the effect of an applied bias, one set of capacitors was kept unbiased, and the other set of capacitors was biased at 5 V. Capacitors of two different sizes were used to investigate the effect of area on reliability under these conditions. Three parameters-capacitance, dissipation factor, and insulation resistance-were monitored in situ every hour during the THB test, which lasted for 2000 h. Data analysis and the physical explanation of change in the electrical parameters under THB conditions are presented in this paper.
  • Keywords
    barium compounds; capacitors; composite materials; dielectric materials; reliability; titanium compounds; BaTiO3; THB conditions; THB test; capacitance; dissipation factor; electrical parameters; embedded planar capacitor reliability; epoxy-composite dielectric; insulation resistance; temperature 85 degC; temperature-humidity-bias tests; time 2000 h; voltage 5 V; Capacitance; Capacitors; Ceramics; Dielectric constant; Polymers; Resistance; Embedded planar capacitors; polymer–ceramic composites; reliability; temperature–humidity–bias (THB) tests;
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2011.2168527
  • Filename
    6021339