DocumentCode :
1323271
Title :
Proposed configuration of integrated optical isolator employing wafer-direct bonding technique
Author :
Yokoi, H. ; Mizumoto, T.
Author_Institution :
Dept. of Phys. Electron., Tokyo Inst. of Technol., Japan
Volume :
33
Issue :
21
fYear :
1997
fDate :
10/9/1997 12:00:00 AM
Firstpage :
1787
Lastpage :
1788
Abstract :
A novel configuration of an integrated optical isolator employing a nonreciprocal phase shift is proposed. The isolator is equipped with a cladding layer of magnetic garnets by means of a wafer-direct bonding technique. Magnetic garnets with a large magnetooptic effect miniaturise the size of the nonreciprocal phase shifter to several hundreds of microns
Keywords :
integrated optics; magneto-optical isolators; optical fabrication; wafer bonding; cladding layer; integrated optical isolator; magnetooptic effect; nonreciprocal phase shift; wafer-direct bonding technique;
fLanguage :
English
Journal_Title :
Electronics Letters
Publisher :
iet
ISSN :
0013-5194
Type :
jour
DOI :
10.1049/el:19971253
Filename :
633393
Link To Document :
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