Title :
Low-Temperature Wiring with Ag Nanoinks [Nanopackaging]
Author :
Suganuma, Katsuaki ; Wakuda, Daisuke ; Hatamura, Mariko ; Nogi, Masaya
Author_Institution :
Tohoku Univ., Sendai, Japan
Abstract :
In this article, the mechanisms of these low-temperature curable inks are briefly reviewed. The dispersant removal by washing in alcohols for the nanoparticle ink and the decomposition behavior of the β-ketocarboxylate ink were clarified by thermal and microstructural analyses. The sintering and growth behaviors were also examined.
Keywords :
ink; nanoelectronics; nanofabrication; nanoparticles; silver; wiring; ß-ketocarboxylate ink; Ag; dispersant removal; low-temperature curable inks; low-temperature wiring; nanoinks; nanoparticle ink; Electronics packaging; Nanoelectronics; Printed circuits; Temperature measurement; Wiring;
Journal_Title :
Nanotechnology Magazine, IEEE
DOI :
10.1109/MNANO.2010.938016
