DocumentCode :
1323366
Title :
Variability compensation for full-swing against low-swing on-chip communication
Author :
Paci, Giacomo ; Bertozzi, Davide ; Benini, Luca
Author_Institution :
DEIS, Univ. of Bologna, Bologna, Italy
Volume :
5
Issue :
5
fYear :
2011
fDate :
9/1/2011 12:00:00 AM
Firstpage :
355
Lastpage :
365
Abstract :
Adaptive body bias (ABB) and adaptive supply voltage (ASV) are effective methods for post-silicon tuning to reduce variability on generic combinational circuits or microprocessor circuit sub-blocks. We focus in this work on global point-to-point interconnects, which are evolving into complex communication channels with drivers and receivers, in an attempt to mitigate the effects of reverse scaling and reduce power. The characterisation of the performance spread of these links and the exploration of effective and power-aware compensation techniques for them is becoming a key design issue. This work compares the effectiveness of ABB against ASV when put at work on two on-chip point-to-point link architectures: a traditional full-swing and a low-swing signalling scheme for low-power communication. This work provides guidelines for the post-silicon variability compensation of these communication channels, while considering realistic layout effects. In particular, the implications of cross-coupling capacitance on the effectiveness of variability compensation are analysed in this work.
Keywords :
capacitance; combinational circuits; compensation; interconnections; microprocessor chips; tuning; adaptive body bias; adaptive supply voltage; complex communication channels; cross-coupling capacitance; full-swing on-chip communication; generic combinational circuits; global point-to-point interconnects; low-swing on-chip communication; microprocessor circuit subblock; on-chip point-to-point link architecture; post-silicon tuning; post-silicon variability compensation; power aware compensation techniques; power reduction; reverse scaling;
fLanguage :
English
Journal_Title :
Computers & Digital Techniques, IET
Publisher :
iet
ISSN :
1751-8601
Type :
jour
DOI :
10.1049/iet-cdt.2009.0103
Filename :
6021393
Link To Document :
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