DocumentCode
1323597
Title
Fluidic Assisted Heterogeneous Integration of Photonic Thin-Film Devices
Author
Xiao, Jing ; Song, Fuchuan ; Seo, Sang-Woo
Author_Institution
Dept. of Electr. Eng., City Coll. of New York, New York, NY, USA
Volume
22
Issue
21
fYear
2010
Firstpage
1622
Lastpage
1624
Abstract
In this letter, we are demonstrating that the fluidic assisted heterogeneous integration is an efficient integration method of various photonic devices with standard silicon electronic devices to realize advanced photonic integrated systems. By using a thin-film device format, which is optimized in its host substrate, its integration on silicon substrate does not interfere with a post layer-by-layer process and provides the best performance of both thin-film devices and silicon-based electronics. A combination of self-assembly and thin-film device technology will lead the way for wafer-scale heterogeneous thin-film integration. The results showed that an array of thin-film devices can be efficiently self-aligned and integrated onto assigned integration. This is also a promising integration method for integrated photonic systems, which combines various photonic devices with silicon-based electronic devices.
Keywords
elemental semiconductors; integrated optics; microfluidics; optical fabrication; photonic band gap; self-assembly; silicon; thin film devices; Si; electronic device; fluidic assisted heterogeneous integration; integrated photonic system; layer-by-layer process; photonic device; photonic integrated system; photonic thin film device; self assembly; thin film device format; thin film device technology; Etching; Optical films; Photonics; Silicon; Substrates; Thin film devices; Fluidic self assembly; heterogeneous integration; thin-film photodetectors;
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2010.2075921
Filename
5570906
Link To Document