Title :
Surface breakdown and stability of high-voltage planar junctions
Author :
Stengl, Reinhard ; Falck, Elmar
Author_Institution :
Siemens AG, Munich, Germany
fDate :
9/1/1991 12:00:00 AM
Abstract :
The authors introduce a one-dimensional model allowing evaluation of the surface electric field of planar resurf diodes or variation in lateral doping structures with an n+-channel stop ring. Based on this model the surface electric field of a resurf diode including a passivation layer with finite sheet resistance (e.g., thermal oxide) is calculated. In a series of self-consistent calculations, where the surface charge density depends on the surface electric field, it is shown that the gradient of the surface electric field causes charge buildup on top of the passivation layer due to its finite sheet resistance. It is shown that these induced surface charges can lead to surface breakdown of the underlying p-n junction. The calculations were confirmed by transient reverse current measurements, performed at a resurf diode with an n+-channel stop ring
Keywords :
electric breakdown of solids; electric fields; p-n junctions; semiconductor device models; semiconductor diodes; stability; finite sheet resistance; high-voltage planar junctions; lateral doping structures; n+-channel stop ring; one-dimensional model; p-n junction; passivation layer; planar resurf diodes; stability; surface charge density; surface electric field; thermal oxide; transient reverse current measurements; Diodes; Doping; Electric breakdown; Electric resistance; P-n junctions; Passivation; Semiconductor process modeling; Stability; Surface resistance; Thermal resistance;
Journal_Title :
Electron Devices, IEEE Transactions on