DocumentCode :
1324955
Title :
Origin of Hopping Conduction in Sn-Doped Silicon Oxide RRAM With Supercritical \\hbox {CO}_{2} Fluid Treatment
Author :
Tsai, Tsung-Ming ; Chang, Kuan-Chang ; Chang, Ting-Chang ; Chang, Geng-Wei ; Syu, Yong-En ; Su, Yu-Ting ; Liu, Guan-Ru ; Liao, Kuo-Hsiao ; Chen, Min-Chen ; Huang, Hui-Chun ; Tai, Ya-Hsiang ; Gan, Der-Shin ; Ye, Cong ; Wang, Hao ; Sze, Simon M.
Author_Institution :
Dept. of Mater. & Optoelectron. Sci., Nat. Sun Yat-Sen Univ., Kaohsiung, Taiwan
Volume :
33
Issue :
12
fYear :
2012
Firstpage :
1693
Lastpage :
1695
Abstract :
In this letter, we investigate the origin of hopping conduction in the low-resistance state (LRS) of a resistive random access memory device with supercritical CO2 fluid treatment. The dangling bonds of a tin-doped silicon oxide ( Sn:SiOx) thin film were cross linked by the hydration-dehydration reaction through supercritical fluid technology. The current conduction mechanism of the LRS in the posttreated Sn:SiOx thin film was transferred to hopping conduction from Ohmic conduction, owing to isolation of metal tin in the Sn:SiOx thin film by hydration-dehydration reaction. The phenomena can be verified by our proposed reaction model, which is speculated by the X-ray photoelectron spectroscopy analyses.
Keywords :
X-ray photoelectron spectra; chemical reactions; dangling bonds; hopping conduction; random-access storage; silicon compounds; tin; Ohmic conduction; SiOx:Sn; Sn-doped silicon oxide RRAM; X-ray photoelectron spectroscopy; current conduction mechanism; dangling bond; hopping conduction; hydration-dehydration reaction; low-resistance state; metal tin; posttreated thin film; reaction model; resistive random access memory device; supercritical CO2 fluid treatment; supercritical fluid technology; tin-doped silicon oxide thin film; Carbon dioxide; Gallium nitride; Nonvolatile memory; Random access memory; Silicon; Thin films; Tin; Hopping conduction; hydration–dehydration reaction; resistance random access memory (RRAM); supercritical fluid;
fLanguage :
English
Journal_Title :
Electron Device Letters, IEEE
Publisher :
ieee
ISSN :
0741-3106
Type :
jour
DOI :
10.1109/LED.2012.2217932
Filename :
6336783
Link To Document :
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