• DocumentCode
    1325315
  • Title

    Neutron-Induced Charge Collection Simulation of Bulk FinFET SRAMs Compared With Conventional Planar SRAMs

  • Author

    Fang, Yi-Pin ; Oates, Anthony S.

  • Author_Institution
    Taiwan Semicond. Manuf. Co., Hsinchu, Taiwan
  • Volume
    11
  • Issue
    4
  • fYear
    2011
  • Firstpage
    551
  • Lastpage
    554
  • Abstract
    The relative neutron-induced soft-error rate (SER) of bulk FinFET SRAMs compared to planar SRAMs is estimated based on drain area, collected charge, and critical charge using mixed-mode 3-D TCAD simulations. The critical charges of the bulk FinFET and planar devices are comparable, with identical gate length, gate width, and gate oxide thickness. However, the charges collected by the bulk FinFET drain due to ion strikes are smaller than those by the planar FET drain. Bulk FinFETs are anticipated to exhibit lower SER sensitivity compared to planar FETs.
  • Keywords
    SRAM chips; radiation hardening (electronics); technology CAD (electronics); bulk FinFET SRAM; conventional planar SRAM; mixed mode 3D TCAD simulations; neutron induced charge collection simulation; neutron induced soft error rate; FinFETs; Logic gates; Neutrons; Random access memory; Substrates; Transient analysis; Charge collection; neutron-induced single-event upset (SEU); single-event transient; soft-error rate (SER);
  • fLanguage
    English
  • Journal_Title
    Device and Materials Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1530-4388
  • Type

    jour

  • DOI
    10.1109/TDMR.2011.2168959
  • Filename
    6024447