Fabrication and characterization of truly 3-D diffuser/nozzle microstructures in silicon

Author

Heschel, M. ; Müllenborn, M. ; Bouwstra, S.

Author_Institution

Mikroelektronik Centret, Lyngby, Denmark

Volume

6

Issue

1

fYear

1997

fDate

3/1/1997 12:00:00 AM

Firstpage

41

Lastpage

47

Abstract

We present microfabrication and characterization of truly three-dimensional (3-D) diffuser/nozzle structures in silicon. Chemical vapor deposition (CVD), reactive ion etching (RIE), and laser-assisted etching are used to etch flow chambers and diffuser/nozzle elements. The flow behavior of the fabricated elements and the dependence of diffuser/nozzle efficiency on structure geometry has been investigated. The large freedom of 3-D micromachining combined with rapid prototyping allows one to characterize and optimize diffuser/nozzle structures

Keywords

Poiseuille flow; chemical vapour deposition; diffusion; elemental semiconductors; flow; laser beam etching; micromachining; micromechanical devices; nozzles; silicon; sputter etching; 3D diffuser/nozzle microstructure; 3D micromachining; CVD; RIE; Si; characterization; chemical vapor deposition; diffuser/nozzle element etching; flow behavior; flow chamber etching; laser-assisted etching; microfabrication; rapid prototyping; reactive ion etching; structure geometry; Chemical elements; Chemical lasers; Chemical vapor deposition; Etching; Fabrication; Geometrical optics; Micromachining; Microstructure; Pumps; Silicon;

fLanguage

English

Journal_Title

Microelectromechanical Systems, Journal of

Publisher

ieee

ISSN

1057-7157

Type

jour

DOI

10.1109/84.557529

Filename

557529