• DocumentCode
    1326528
  • Title

    Robust Spot-Packaged Microsphere-Taper Coupling Structure for In-Line Optical Sensors

  • Author

    Yan, Ying-Zhan ; Zou, Chang-Ling ; Yan, Shu-Bin ; Sun, Fang-Wen ; Liu, Jun ; Xue, Chen-Yang ; Zhang, Yu-Guang ; Wang, Li ; Zhang, Wen-Dong ; Xiong, Ji-Jun

  • Author_Institution
    Key Lab. of Instrum. Sci. & Dynamic Meas., North Univ. of China, Taiyuan, China
  • Volume
    23
  • Issue
    22
  • fYear
    2011
  • Firstpage
    1736
  • Lastpage
    1738
  • Abstract
    We propose and realize a spot-packaged structure for the microsphere-taper coupling system by only encapsulating and solidifying the coupling region with low refractive index polymer as the package material. After spot-package, ultrahigh quality factor ( >; 107) is obtained with the microsphere diameters around 300 μm. The robustness of the spot-packaged structure is also tested, demonstrating the remarkable anti-tensile strength ability with the bearable loaded force larger than 0.05 N for a packaged structure with the spot-package area larger than 30 μm2. In addition, the spot-packaged structure is integrated with standard fiber, promising in in-line optical practical evanescent field sensing applications, especially in harsh detecting environments demanding high overload resistance.
  • Keywords
    Q-factor; electronics packaging; encapsulation; fibre optic sensors; micro-optomechanical devices; microsensors; optical polymers; refractive index; solidification; tensile strength; antitensile strength; encapsulation; low refractive index polymer; optical practical evanescent field sensing; optical sensors; packaging material; robust spot-packaged microsphere-taper coupling; solidification; standard fiber; ultrahigh quality factor; Couplings; Microcavities; Optical sensors; Optical surface waves; Optimized production technology; Robustness; Fiber taper; microsphere resonator; optical sensor; package; whispering gallery modes (WGMs);
  • fLanguage
    English
  • Journal_Title
    Photonics Technology Letters, IEEE
  • Publisher
    ieee
  • ISSN
    1041-1135
  • Type

    jour

  • DOI
    10.1109/LPT.2011.2169051
  • Filename
    6025264