DocumentCode
1326528
Title
Robust Spot-Packaged Microsphere-Taper Coupling Structure for In-Line Optical Sensors
Author
Yan, Ying-Zhan ; Zou, Chang-Ling ; Yan, Shu-Bin ; Sun, Fang-Wen ; Liu, Jun ; Xue, Chen-Yang ; Zhang, Yu-Guang ; Wang, Li ; Zhang, Wen-Dong ; Xiong, Ji-Jun
Author_Institution
Key Lab. of Instrum. Sci. & Dynamic Meas., North Univ. of China, Taiyuan, China
Volume
23
Issue
22
fYear
2011
Firstpage
1736
Lastpage
1738
Abstract
We propose and realize a spot-packaged structure for the microsphere-taper coupling system by only encapsulating and solidifying the coupling region with low refractive index polymer as the package material. After spot-package, ultrahigh quality factor ( >; 107) is obtained with the microsphere diameters around 300 μm. The robustness of the spot-packaged structure is also tested, demonstrating the remarkable anti-tensile strength ability with the bearable loaded force larger than 0.05 N for a packaged structure with the spot-package area larger than 30 μm2. In addition, the spot-packaged structure is integrated with standard fiber, promising in in-line optical practical evanescent field sensing applications, especially in harsh detecting environments demanding high overload resistance.
Keywords
Q-factor; electronics packaging; encapsulation; fibre optic sensors; micro-optomechanical devices; microsensors; optical polymers; refractive index; solidification; tensile strength; antitensile strength; encapsulation; low refractive index polymer; optical practical evanescent field sensing; optical sensors; packaging material; robust spot-packaged microsphere-taper coupling; solidification; standard fiber; ultrahigh quality factor; Couplings; Microcavities; Optical sensors; Optical surface waves; Optimized production technology; Robustness; Fiber taper; microsphere resonator; optical sensor; package; whispering gallery modes (WGMs);
fLanguage
English
Journal_Title
Photonics Technology Letters, IEEE
Publisher
ieee
ISSN
1041-1135
Type
jour
DOI
10.1109/LPT.2011.2169051
Filename
6025264
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