• DocumentCode
    132684
  • Title

    A compact Drive-by-Microwave gate driver with coupler integrated in a package

  • Author

    Nagai, Shuichi ; Kawai, Yusuke ; Tabata, Osamu ; Fujiwara, H. ; Otsuka, N. ; Ueda, Daisuke ; Negoro, Noboru ; Ishida, Makoto

  • Author_Institution
    Device Solutions Center, Panasonic Corp., Moriguchi, Japan
  • fYear
    2014
  • fDate
    16-20 March 2014
  • Firstpage
    1461
  • Lastpage
    1464
  • Abstract
    A low cost and compact isolated gate driver with Drive-by-Microwave technology is developed, which consists of 2.4 GHz GaN/Si transmitter and receiver chips and the butterfly isolation coupler that integrated in a printed circuit board based package. The fabricated DBM gate driver successfully demonstrated that it drove a GaN power switching device with a very fast switching. The fabricated DBM gate driver was implemented the multi-level output function, which has the potential to realize the gate voltage profile control of a power switching device for a waveform shaping. And this function can also contribute the power consumption saving of the gate driver itself by low power output at on-state and off-state other than turn-on and turn-off.
  • Keywords
    III-V semiconductors; UHF circuits; UHF couplers; driver circuits; elemental semiconductors; gallium compounds; microwave circuits; power semiconductor switches; printed circuits; semiconductor device packaging; silicon; wide band gap semiconductors; GaN-Si; butterfly isolation coupler; compact drive-by-microwave isolated gate driver; fabricated DBM gate driver; frequency 2.4 GHz; gate voltage profile control; multi-level output function; packaging; power consumption saving; power switching device; printed circuit board; receiver chip; transmitter chip; waveform shaping; Couplers; Gallium nitride; Logic gates; Receivers; Silicon; Switches; Transmitters;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2014 Twenty-Ninth Annual IEEE
  • Conference_Location
    Fort Worth, TX
  • Type

    conf

  • DOI
    10.1109/APEC.2014.6803499
  • Filename
    6803499