• DocumentCode
    1327045
  • Title

    Substrate bias effects on drain-induced barrier lowering in short-channel PMOS devices

  • Author

    Deen, Jamal M. ; Yan, Z.X.

  • Author_Institution
    Sch. of Eng. Sci., Simon Fraser Univ., Barnaby, BC, Canada
  • Volume
    37
  • Issue
    7
  • fYear
    1990
  • fDate
    7/1/1990 12:00:00 AM
  • Firstpage
    1707
  • Lastpage
    1713
  • Abstract
    It was found that, as the channel length decreased, the threshold voltage shift caused by drain-induced barrier lowering (DIBL) first increased with increasing substrate bias and then decreased as the channel length decreased further. The channel length (LINT ) corresponding to an almost zero change of the DIBL variation with substrate bias was found to be between 0.78 and 0.90 μm for the PMOS devices. This change in DIBL with substrate bias for devices with varying L can be explained as the transition of the surface DIBL effect to the subsurface DIBL effect and the onset of the punchthrough effect. Based on the experimental results, an empirical model for describing this substrate bias characteristic of the DIBL effect is developed
  • Keywords
    insulated gate field effect transistors; metal-insulator-semiconductor devices; semiconductor device models; 0.78 to 0.90 micron; DIBL; bias characteristic; channel length; drain-induced barrier lowering; empirical model; punchthrough effect; short-channel PMOS devices; substrate bias; threshold voltage shift; CMOS technology; Doping profiles; Helium; Implants; MOS devices; MOSFET circuits; Numerical simulation; Semiconductor process modeling; Threshold voltage; Very large scale integration;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/16.55758
  • Filename
    55758