Title :
Hybrid-mode computation of propagation and attenuation characteristics of parallel coupled microstrips with finite metallization thickness
Author :
Kuo, Jen-Tsai ; Itoh, Tatsuo
Author_Institution :
Dept. of Commun. Eng., Nat. Chiao Tung Univ., Hsinchu, Taiwan
fDate :
2/1/1997 12:00:00 AM
Abstract :
The hybrid-mode mixed spectral domain approach (MSDA) is formulated to investigate the dispersion nature of multiple coupled microstrip lines with arbitrary metallization thickness. Incorporated into the solution procedure, a new set of basis functions with δ -1/3 field singularity near conductor edges is found to be effective in calculating both the phase and attenuation constants. The computation of conductor loss is based on the perturbation procedure. Over a broad band of frequency spectrum, excellent agreement is obtained between the calculated results and existing experiment data for the metallic losses of a single microstrip and effective dielectric constants of coupled lines. The influence of finite metallization thickness on the frequency dependent modal propagation and attenuation characteristics is presented for both a three-line and four-line structure
Keywords :
losses; metallisation; microstrip lines; permittivity; spectral-domain analysis; waveguide theory; attenuation characteristics; attenuation constants; basis functions; conductor loss; dispersion nature; effective dielectric constants; finite metallization thickness; four-line structure; frequency dependent modal characteristics; hybrid-mode computation; hybrid-mode mixed spectral domain approach; metallic losses; multiple coupled microstrip lines; parallel coupled microstrips; perturbation procedure; phase constants; propagation characteristics; three-line structure; Attenuation; Concurrent computing; Conductors; Frequency; Metallization; Microstrip; Microwave propagation; Planar transmission lines; Planar waveguides; Strips;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
