• DocumentCode
    132736
  • Title

    Fault tolerant drive module via electromechanical alteration of circuit topology

  • Author

    Maharjan, Lizon ; Arbab, Nasim ; Fahimi, B.

  • Author_Institution
    Renewable Energy & Vehicular Technol. Lab., Univ. of Texas at Dallas, Richardson, TX, USA
  • fYear
    2014
  • fDate
    16-20 March 2014
  • Firstpage
    1626
  • Lastpage
    1632
  • Abstract
    The current technology applied in power electronic converter designs is based on stationary placement of power switches. Most fault tolerant realizations require additional switches (redundancy approach). The motivation behind this paper is to engineer a solution which can allow for a dynamic circuit topology, thereby elevate the size, cost, and complexity issues associated with current technology. The dynamic relocation is attained through piezoelectric actuation. Along with introduction to such dynamic circuit topology, this paper also discusses the process of modeling, and practical aspects and limitations under different load conditions. The presented concept will generate new opportunities in effective thermal management and reduced part converter topologies which can in turn introduce substantial saving in developmental cost and the required footprint.
  • Keywords
    electric drives; fault tolerance; network topology; piezoelectric actuators; power convertors; switches; complexity issue; developmental cost; dynamic circuit topology; dynamic relocation; effective thermal management; electromechanical alteration; fault tolerant drive module; fault tolerant realization; piezoelectric actuation; power electronic converter designs; power switch stationary placement; reduced part converter topology; redundancy approach; substantial saving; Actuators; Analytical models; Bridge circuits; Copper; Strain; Structural beams; Voltage control; converter; dynamic circuit topology; fault tolerant; piezoelectric;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Power Electronics Conference and Exposition (APEC), 2014 Twenty-Ninth Annual IEEE
  • Conference_Location
    Fort Worth, TX
  • Type

    conf

  • DOI
    10.1109/APEC.2014.6803524
  • Filename
    6803524