Micromachined Probes for Submillimeter-Wave On-Wafer Measurements—Part I: Mechanical Design and Characterization

Author

Reck, Theodore J. ; Chen, Lihan ; Zhang, Chunhu ; Arsenovic, Alex ; Groppi, Christopher ; Lichtenberger, Arthur W. ; Weikle, Robert M., II ; Barker, N. Scott

Author_Institution

Jet Propulsion Lab., Pasadena, CA, USA

Volume

1

Issue

2

fYear

2011

Firstpage

349

Lastpage

356

Abstract

The mechanical design and characterization of a micromachined on-wafer probe scalable to submillimeter-wave frequencies is presented. The design consists of a silicon micromachined probe with a ground-signal-ground configuration on a 15 μm thick silicon substrate. This micromachined chip is housed in a metal waveguide block that provides mechanical support for the probe and enables coupling to a waveguide flange. Load-cell measurements of the probe show a DC contact resistance below 0.07 Ω with an applied force of 1 mN. A companion paper presents the electromagnetic design and calibrated on-wafer measurements at 500 to 750 GHz.

Keywords

calibration; coplanar waveguides; micromachining; rectangular waveguides; silicon; submillimetre wave couplers; submillimetre wave measurement; substrates; Si; calibrated on-wafer measurements; electromagnetic design; frequency 500 GHz to 750 GHz; ground-signal-ground configuration; mechanical design; micromachined probes; silicon micromachined probe; silicon substrate; size 15 mum; submillimeter-wave on-wafer measurements; Coplanar waveguides; Micromachining; Rectangular waveguides; Submillimeter wave integrated circuits; Submillimeter wave measurements; Coplanar waveguide; micromachining; rectangular waveguide; submillimeter-wave integrated circuits; submillimeter-wave measurements;

fLanguage

English

Journal_Title

Terahertz Science and Technology, IEEE Transactions on

Publisher

ieee

ISSN

2156-342X

Type

jour

DOI

10.1109/TTHZ.2011.2165013

Filename

6026246