Estimating the Process Yield of Multiple Characteristics With One-Sided Specifications

Author

Wang, Fu-Kwun

Author_Institution

Dept. of Ind. Manage., Nat. Taiwan Univ. of Sci. & Technol., Taipei, Taiwan

Volume

25

Issue

1

fYear

2012

Firstpage

57

Lastpage

62

Abstract

This paper proposes a procedure for estimating the process yield of multiple characteristics with one-sided specifications in a manufacturing process. The proposed process yield indices can be applied for a multivariate normality data or a multivariate non-normality data. These indices provide an exact measure of the overall process yield. Also, the approximate lower confidence bound for the true process yield is presented. Three examples are used to demonstrate the performance of the proposed approach. The results show that our procedure is an effective approach.

Keywords

manufacturing processes; semiconductor device manufacture; manufacturing process; multivariate nonnormality data; multivariate normality data; one-sided specification; process yield estimation; Eigenvalues and eigenfunctions; Equations; Gaussian distribution; Indexes; Manufacturing processes; Principal component analysis; Semiconductor device measurement; Multiple characteristics; one-sided specifications; process yield;

fLanguage

English

Journal_Title

Semiconductor Manufacturing, IEEE Transactions on

Publisher

ieee

ISSN

0894-6507

Type

jour

DOI

10.1109/TSM.2011.2169093

Filename

6026963