DocumentCode
1328678
Title
A new method for determining the secondary electron yield dependence on ion energy for plasma exposed surfaces
Author
En, William ; Cheung, Nathan W.
Author_Institution
Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
Volume
24
Issue
3
fYear
1996
fDate
6/1/1996 12:00:00 AM
Firstpage
1184
Lastpage
1187
Abstract
A new experimental method for determining the secondary electron yield for plasma exposed surfaces is described. From the measurement of the plasma condition and the total current generated when a voltage pulse is applied to a target material exposed to a plasma, the dependence of the secondary electron yield of that target on ion energy can be extracted. The secondary electron yield is determined by an analytical model of the plasma ion, electron, and displacement currents. Experimental results for an aluminum target correlate well with previous secondary electron measurements which used a traditional technique. Secondary electrons yield data of other materials: single crystal silicon, aluminum, titanium nitride, and silicon dioxide are also extracted
Keywords
plasma collision processes; plasma-wall interactions; Al; Si; SiO2; TiN; analytical model; ion energy; plasma condition; plasma exposed surfaces; secondary electron yield; single crystal; total current; voltage pulse; Aluminum; Current measurement; Data mining; Electrons; Energy measurement; Plasma materials processing; Plasma measurements; Pulse generation; Pulse measurements; Voltage;
fLanguage
English
Journal_Title
Plasma Science, IEEE Transactions on
Publisher
ieee
ISSN
0093-3813
Type
jour
DOI
10.1109/27.533128
Filename
533128
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