• DocumentCode
    1328678
  • Title

    A new method for determining the secondary electron yield dependence on ion energy for plasma exposed surfaces

  • Author

    En, William ; Cheung, Nathan W.

  • Author_Institution
    Dept. of Electr. Eng., California Univ., Berkeley, CA, USA
  • Volume
    24
  • Issue
    3
  • fYear
    1996
  • fDate
    6/1/1996 12:00:00 AM
  • Firstpage
    1184
  • Lastpage
    1187
  • Abstract
    A new experimental method for determining the secondary electron yield for plasma exposed surfaces is described. From the measurement of the plasma condition and the total current generated when a voltage pulse is applied to a target material exposed to a plasma, the dependence of the secondary electron yield of that target on ion energy can be extracted. The secondary electron yield is determined by an analytical model of the plasma ion, electron, and displacement currents. Experimental results for an aluminum target correlate well with previous secondary electron measurements which used a traditional technique. Secondary electrons yield data of other materials: single crystal silicon, aluminum, titanium nitride, and silicon dioxide are also extracted
  • Keywords
    plasma collision processes; plasma-wall interactions; Al; Si; SiO2; TiN; analytical model; ion energy; plasma condition; plasma exposed surfaces; secondary electron yield; single crystal; total current; voltage pulse; Aluminum; Current measurement; Data mining; Electrons; Energy measurement; Plasma materials processing; Plasma measurements; Pulse generation; Pulse measurements; Voltage;
  • fLanguage
    English
  • Journal_Title
    Plasma Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0093-3813
  • Type

    jour

  • DOI
    10.1109/27.533128
  • Filename
    533128